Introduction: HiSilicon Kirin 810 vs Qualcomm Snapdragon 720G
In the entire arena of mobile processors, there are several middlemen that compete when it comes to performance in its price bracket; HiSilicon Kirin 810 and Qualcomm Snapdragon 720G just so happen to be two of those chips promising to truly shine in power efficiency, gaming prowess, multimedia enhancements (HDR displays), as well as AI capabilities by the boatloads.
The Huawei Kirin 810 is another chip to come from HiSilicon (Huawei) that uses a highly optimized 7nm process to deliver leading performance with AI. On the other hand, Snapdragon 720G is a G-series of Qualcomm Snapdragon and this lineup is more gaming focused with flagship grade AI and tech capabilities.
Comparison of HiSilicon Kirin 810 vs Qualcomm Snapdragon 720G
Specification | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
Manufacturing Process | 7nm | 8nm |
CPU Architecture | 2x Cortex-A76 @ 2.27 GHz, 6x Cortex-A55 @ 1.88 GHz | 2x Kryo 465 Gold @ 2.3 GHz, 6x Kryo 465 Silver @ 1.8 GHz |
GPU | Mali-G52 MP6 | Adreno 618 |
AI Performance | Da Vinci NPU | Hexagon 692 |
RAM Support | LPDDR4x (2133 MHz) | LPDDR4x (1866 MHz) |
AnTuTu Score | ~300,000 | ~280,000 |
GeekBench Score | Single-core: ~700, Multi-core: ~2,400 | Single-core: ~570, Multi-core: ~1,750 |
ISP Features | Dual ISP | Spectra 350L |
Connectivity | LTE Cat. 12/13, Wi-Fi 5 | LTE Cat. 15, Wi-Fi 6 |
Power Efficiency | High (7nm node) | Moderate (8nm node) |
Specification
CPU Specifications
CPU Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
Architecture | 2x Cortex-A76 + 6x Cortex-A55 | 2x Kryo 465 Gold + 6x Kryo 465 Silver |
Clock Speed (Max) | 2.27 GHz | 2.3 GHz |
GPU Specifications
GPU Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
GPU Model | Mali-G52 MP6 | Adreno 618 |
Frequency | 820 MHz | 750 MHz |
AI Accelerator
Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
AI Performance (TOPS) | ~4.4 | ~3.0 |
Memory Support
Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
RAM Type | LPDDR4x | LPDDR4x |
Max RAM Frequency | 2133 MHz | 1866 MHz |
Multimedia (ISP)
Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
ISP Model | Dual ISP | Spectra 350L |
Max Camera Support | 48 MP | 192 MP |
Connectivity
Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
LTE Category | Cat. 12/13 | Cat. 15 |
Wi-Fi | Wi-Fi 5 | Wi-Fi 6 |
Bluetooth | 5.0 | 5.1 |
Power Efficiency
Feature | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
Process Node | 7nm | 8nm |
Power Efficiency Level | High | Moderate |
Benchmark
AnTuTu 10
Benchmark Component | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
CPU Score | ~100,000 | ~95,000 |
GPU Score | ~85,000 | ~80,000 |
Memory Score | ~60,000 | ~55,000 |
UX Score | ~55,000 | ~50,000 |
GeekBench 6
Benchmark Component | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
Single-core | ~700 | ~570 |
Multi-core | ~2,400 | ~1,750 |
Smartphones
Model | HiSilicon Kirin 810 | Qualcomm Snapdragon 720G |
---|---|---|
Smartphone Models | Huawei Nova 5, Honor 9X Pro | Redmi Note 9 Pro, Realme 6 Pro |
Your question and our opinion about the HiSilicon Kirin 810 vs Snapdragon 720G
- Which chip is more power-efficient?
Kirin 810, due to the 7nm process.- Which is better for gaming?
Snapdragon 720G with Adreno 618 offers better optimization.- Which chip has better AI performance?
Kirin 810 with Da Vinci NPU.- Which has better connectivity options?
Snapdragon 720G, with Wi-Fi 6 and Bluetooth 5.1.- Which supports higher camera resolution?
Snapdragon 720G (up to 192 MP).- Which has a better ISP?
Snapdragon 720G with Spectra 350L.- Which performs better in benchmarks?
Kirin 810 scores higher in both AnTuTu and GeekBench.- Which chip is newer?
Both were released around 2019-2020.- Which is more widely used in budget smartphones?
Snapdragon 720G.- Which is better overall?
It depends on the use case: Kirin 810 for efficiency and benchmarks, Snapdragon 720G for gaming and connectivity.